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product structure silicon monolithic integrated circuit this product has no designed protection against radioactive ra ys . 1/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 14 ? 001 www.rohm.com 09.dec.2015 rev.001 motor drivers for digital still cameras 5-ch annel system lens driver for digital still cameras bd6758mwv BD6758KN general description the bd6758mwv and BD6758KN are motor drivers that integrate 4 full- on type h-bridges and 1 linear constant-current ty pe h-bridge . t he se devices are intended to drive a stepping motor for auto focus system , and to drive dc motors for zoom and iris. features ? low on-resistance power cmos output ? drive mode switch function ? h igh -precision(3%) linear constant-current driver ? phase compensation capacitor-free design for linear constant-current drive block ? h igh -precision (1.2v3%) reference voltage ? under voltage locked out protection & thermal shut down circuit applications ? mobile system ? home appliance ? amusement system, etc key specifications ? power supply voltage range: 2.5v to 5.5v ? motor power supply voltage r ange: 2.5v to 5.5v ? circuit current(no signal & no load): 1.4ma(typ) ? stand-by current: 10 a( max) ? control input voltage range: 0v to v cc v ? h-bridge output current: -0.5a/ch to +0.5a/ch ? output on-resistance(channel 1 to 4): 1.2 (typ) ? output on-resistance(channel 5): 1.0 (typ) ? operating temperature r an ge: - 25 c to +85c package w( typ) x d(typ) x h(max) uqfn036v5050 5.00mm x 5.00mm x 1.00mm vqfn36 6.20mm x 6.20mm x 0.95mm datashee t datashee t downloaded from: http:///
. 2/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.co.jp 09.dec.2015 rev.001 bd6758mwv bd6 758kn typical application circuit the output current is converted to a voltage with the r nf external resistor and transmitted to the sense pin. i out [a] = v lim [v]r rnf [] ps vcc 1f to 1 00 f out1a out1b level shift & pre driver out2a out2b h bridge full on h bridge full on m in1a bandgap tsd & uvlo 35 4 29 30 33 34 power save 1f to 1 00 f vm1 31 pgnd1 32 out3a out3b level shift & pre driver out4a out4b h bridge full on h bridge full on m 12 13 16 17 1f to 100 f 14 pgnd2 15 vm2 in1b 36 1 in2a in2b 2 3 sel1 28 logic12 in3b 6 7 in4a in4b 8 9 in3a bypass filter capacitor for power supply input. bypass filter capacitor for power supply input. bypass filter capacitor for power supply input. power-saving h : active l : standby motor control input drive mode selection l : en/in h : in/in motor control input drive mode selection l : en/in h : in/in rnf 0.1 to 5.0 out5a out5b h bridge const. current 21 25 23 1f to 100 f vm3 24 en1 27 in5 26 logic5 sense 22 gnd 5 vref vref 20 bypass filter capacitor for power supply input. motor control input vlim 19 r 1 r 2 when using the vref voltage (1.2v) resistance division value as vlim input value, select r 1 and r 2 values such that, 2k r 1 +r 2 20k level shift & pre driver sel2 18 brk1 brk2 10 11 logic34 motor control input brake function h : brake downloaded from: http:///
. 3/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.co.jp 09.dec.2015 rev.001 bd6758mwv bd6 758kn pin configurations pin descriptions pin no. pin name function pin no. pin name function 1 in1b control logic input 1b 19 vlim output current setting ch.5 2 in2a control logic input 2a 20 vref reference voltage output 3 in2b control logic input 2b 21 out5a h-bridge output 5a 4 vcc power supply 22 sense output current detection ch.5 5 gnd ground 23 rnf current detect resistor ch .5 6 in3a control logic input 3a 24 vm3 motor power supply ch.5 7 in3b control logic input 3b 25 out5b h-bridge output 5b 8 in4a control logic input 4a 26 in5 control logic input ch.5 9 in4b control logic input 4b 27 en1 control logic input ch .5 10 brk1 control logic input ch.3 28 sel1 drive mode select ch.1 & ch .2 11 brk2 control logic input ch.4 29 out1a h-bridge output 1a 12 out3a h-bridge output 3a 30 out1b h-bridge output 1b 13 out3b h-bridge output 3b 31 vm1 motor power supply ch. 1 & ch.2 14 vm2 motor power supply ch.3 & ch.4 32 pgnd1 motor ground ch.1 & ch.2 15 pgnd2 motor ground ch.3 & ch.4 33 out2a h-bridge output 2a 16 out4a h-bridge output 4a 34 out2b h-bridge output 2b 17 out4b h-bridge output 4b 35 ps power saving 18 sel2 drive mode select ch.3 & ch.4 36 in1a control logic input 1a top view bd6758mwv BD6758KN 36 9 18 sel1 out1a out1b vm1 pgnd1 out2a out2b ps in1a sel2 out4b out4a pgnd2 vm2 out3b out3a brk2 brk1 27 en1 in5 out5b vm3 rnf sense out5a vref vlim in1b in2a gnd in3a in3b in4a in4b in2b vcc downloaded from: http:///
. 4/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.co.jp 09.dec.2015 rev.001 bd6758mwv bd6 758kn ps vcc out1a out1b level shift & pre driver out2a out2b h-bridge full on h-bridge full on in1a bandgap tsd & uvlo 35 4 29 30 33 34 power save vm1 31 pgnd1 32 out3a out3b level shift & pre driver out4a out4b h-bridge fu ll on h-bridge full on 12 13 16 17 14 pgnd2 15 vm2 in1b 36 1 in2a in2b 2 3 sel1 28 logic12 in3b 6 7 in4a in4b 8 9 in3a rnf out5a out5b h-bridge const. current 21 25 23 vm3 24 en1 27 in5 26 logic5 sense 22 gnd 5 vref vref 20 vlim 19 level shift & pre driver sel2 18 brk1 brk2 10 11 logic34 block diagram description of blocks 1. power-saving function a power-saving function is included, which allows the system to save power when not driving the motor. the voltage level on this pin should be set high so as to keep the operation mode. (see the electrica l characteristics; p.6/ 16) 2. motor control input (a) in1a to in5b, en1, and in5 p in s logic level controls the output logic of h-bridge. (see the electrical characteristics; p.6 /1 6, and i/o truth table; p.8 /1 6) (b) sel1 & sel2 p in s logic level sets the in/in or en/in drive mode. (see the electrical characteristics; p.6 /1 6 and i/o truth table; p.8 /1 6) (c) brk1 & brk2 p in s in case of en/in mode, logic high puts the device in short brake mo de. (see the electrical characteristics; p .6 /1 6, and i/o truth table; p .8 /1 6) 3. h-bridge each h-bridge can be controlled independently. it is therefo re possible to drive the h-bridges simultaneously, as l ong as the package thermal tolerances are not exceeded. be cause the respective output transistors consist of power cmos which consumes a motor power supply v m , t he on -resistance value of high and low-side total is depend ent on v m voltage. further, t he whole application must be designed so that the maxim um current of each channel may be 500ma or below. (see the recommended operating conditions; p.6 /1 6) downloaded from: http:///
. 5/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.co.jp 09.dec.2015 rev.001 bd6758mwv bd6 758kn description of blocks C continued 4. drive system of linear constant-current h-bridge (channel 5) (a) reference output voltage (with a tolerance of 3%) the vref pin can output 1.2v based on the internal reference voltage . the output current of the constant-current drive block can be controlled by connecting e xternal resist or to the vref pin and setting the voltage which is divided by the resistor to the output c urrent setting pin (vlim pin). it is recommended to place the external 2k or above resistor in consideration of the lo ad current capacity of the vref pin, and to place the 20k or below resistor in order to minimize the fluctuation caused by the base current of the internal transistor. (b) output current detection and current settings a low-value ( 0.1 to 5.0 ) resistor can be placed between the rnf pin and ground to detect the motor winding current. when making the rnf and sense pins short-circuit, the intern al circuits can output the accurate constant current by comparing the vlim voltage with detecting vol tage. to make more accurate motor winding current, trim the external rnf resist or , and supply vlim pin with another precise externa l voltage. in case of this condition, vref pin should be kept open. output current value i out [a] = vlim[v] / rnf[ ] the motor winding current will be equal to 400ma ? 3% , if 0.2v is set to the vlim pin and a 0.5 external resistor is connected to the rnf pin. if the vlim pin is shorted to the vcc pin (or th e same voltage as the v cc is set) and the sense and rnf pins are shorted to the ground, this channel can drive a s a full-on type h-bridge like other channels. downloaded from: http:///
. 6/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.co.jp 09.dec.2015 rev.001 bd6758mwv bd6 758kn absolute maximum ratings (ta=25c) parameter symbol limit unit bd6758mwv BD6758KN power supply voltage v cc 0 to +7.0 0 to +7.0 v motor power supply voltage v m 0 to +7.0 0 to +7.0 v control input voltage v in 0 to +v cc 0 to +v cc v power dissipation pd 0.88 (note 1) 0.87 (note 2) w h-bridge output current i out -0.8 to +0.8 (note 3) -0.8 to +0.8 (note 3) a/ch storage temperature range tstg -55 to +150 - 55 to +150 c junction temperature tjmax 150 150 c (note 1) reduced by 7.04mw/c over 25c, when mounted on a glass epoxy board (74.2mm x 74.2mm x 1.6mm) (note 2) reduced by 6.96mw/c over 25c, when mounted on a glass epoxy board (70mm x 70mm x 1.6mm) (n ote 3) must not exceed pd, aso, or tjmax of 150c caution : operating the ic over the absolute maximum ratings may damage t he ic. the damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the ic is operated over the absolute maximum ratings. recommended operating conditions parameter symbol bd6758mwv BD6758KN unit min typ max min typ max power supply voltage v cc 2.5 - 5.5 2.5 - 5.5 v motor power supply voltage v m 2.5 - 5.5 2.5 - 5.5 v control input voltage v in 0 - v cc 0 - v cc v h-bridge output current (note 4) i out - 0. 5 - +0.5 - 0. 5 - +0.5 a/ch control input frequency (note 5) f in 0 - 100 0 - 100 khz operating temperature range topr - 25 - +85 - 25 - + 85 c (note 4) must not exceed pd, aso, or tjmax of 150c (note 5) on duty=50% electrical characteristics (unless otherwise specified v cc =3.0v , v m =5.0v , ta=25c) parameter symbol min typ max unit conditions all circuits stand-by current i ccst - 0 10 a v ps =0v circuit current i cc - 1.4 2.5 ma v ps =3v with no signal and no load control input (in=ps, in1a to in 4b, sel1, sel2, brk1, brk2, en1, in5) high level input voltage v inh 2.0 - v cc v low level input voltage v inl 0 - 0.7 v high level input curr ent i inh 15 30 60 a v in =3v low level input current i inl -1 0 - a v in =0v pull-down resistor r in 50 100 200 k under voltage locked out (uvlo) uvlo voltage v uvlo 1.6 - 2.4 v full on type h-bridge driver (channel 1 to channel 4) output on-resistance r on - 1.2 1.5 i out =400ma, high & low-side total linear constant-current drive block (channel 5) output on-resistance r on - 1.0 1.25 i out =400ma, high & low-side total vref output voltage v ref 1.16 1.20 1.24 v i out =0 ma to 1ma output limit voltage v ol 194 200 206 mv r rn f =0.5 , v vl im =0.2v downloaded from: http:///
. 7/ 16 tsz02201-0h3h0b601360-1-2 ? 2015 rohm co., ltd. all rights reserved. tsz22111 ? 15 ? 001 www.rohm.co.jp 09.dec.2015 rev.001 bd6758mwv bd6 758kn typical performance curves (reference data) figure 1. circuit current vs supply voltage figure 2. output on-resistance vs motor power supply voltage (channel 1 to channel 4, v cc =3v) figure 3. output on -resistance vs motor power supply voltage (c hannel 5, v cc =3v) figure 4. rnf voltage vs vlim voltage (output limit voltage, r rnf =0.5 ) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 power supply voltage : v cc [v] circuit current : i cc [ma] top 85c mid 25c low - 25 c operating range (2.5v to 5.5v) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 motor power supply voltage : v m [v] output on resistance : r on [] top 85c mid 25 c low - 25 c operating range (2.5v to 5.5v) 0.0 1.0 2.0 3.0 4.0 5.0 0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 motor power supply voltage : v m [v] output on resistance : r on [] top 85c mid 25c low - 25 c operating range (2.5v to 5.5v) 0 50 100 150 200 250 0 50 100 150 200 250 vlim voltage : v m [v] rnf voltage : v rnf [v] top 85c mid 25c low - 25 c downloaded from: http:///
8/ 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 timing chart table 1. i/o truth tabl e (channel 1 & channel 2) input mode input output sel1 inxa inxb outxa outxb output m ode (note 6) en/in l h x z z open l l h l cw l h l h ccw in/in h l l z z open h l h l cw l h l h ccw h h l l short brake l: low, h: high, x: don t care, z: hi impedance (note 6) cw : current flows from outxa to outxb, ccw: current flows from outxb to outxa (x=1, 2) table 2. i/o truth tabl e (channel 3 & channel 4) input mode input output sel2 inxa inxb brkx outxa outxb output m ode (note 7) en/in l h x x z z open l l l h l cw l h l l h ccw l x h l l short brake in/in h l l x z z open h l x h l cw l h x l h ccw h h x l l short brake l: low, h: high, x: don t care, z: hi impedance (note 7 ) cw : current flows from outxa to outxb, ccw: current flows from outxb to outxa (x=3,4) table 3. i/o truth tabl e (channel 5) input mode input output en1 in5 out5a out5b output m od e (note 8) en/in h x z z open l l h l cw l h l h ccw l: low, h: high, x: don t care, z: hi impedance (note 8 ) cw : current flows from out5a to out5b, ccw: current flows from out5b to out5a downloaded from: http:///
9/ 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 application example selection of components externally connected when using the circuit with changes to the external circu it constants, make sure to leave an adequate margin for e xternal components including static and transitional characteristic s as well as dispersion of the ic. the output current is converted to a voltage with the r nf external resistor and transmitted to the sense pin. i out [a] = v lim [v]r rnf [] ps vcc 1f to 1 00 f out1a out1b level shift & pre driver out2a out2b h bridge full on h bridge full on m in1a bandgap tsd & uvlo 35 4 29 30 33 34 power save 1f to 1 00 f vm1 31 pgnd1 32 out3a out3b level shift & pre driver out4a out4b h bridge full on h bridge full on m 12 13 16 17 1f to 100 f 14 pgnd2 15 vm2 in1b 36 1 in2a in2b 2 3 sel1 28 logi c12 in3b 6 7 in4a in4b 8 9 in3a bypass filter capacitor for power supply input. bypass filter capacitor for power supply input. bypass filter capacitor for power supply input. power-saving h : active l : standby motor control input drive mode selection l : en/in h : in/in motor control input drive mode selection l : en/in h : in/in rnf 0.1 to 5.0 out5a out5b h bridge const. current 21 25 23 1f to 100 f vm3 24 en1 27 in5 26 logic5 sense 22 gnd 5 vref vref 20 bypass filter capacitor for power supply input. motor control input vlim 19 r 1 r 2 when using the vref voltage (1.2v) resistance division value as vlim input value, select r 1 and r 2 values such that, 2k r 1 +r 2 20k level shift & pre driver sel2 18 brk1 brk2 10 11 logic34 motor control input brake function h : brake downloaded from: http:///
10 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 power dissipation figure 5 . bd6758mwv power dissipation vs ambient temperature figure 6. BD6758KN power dissipation vs ambient temperature i/o equivalent circuits ps, inxa, inxb, en1, in5, sel1, sel2, brk1, brk2 vmx, outxa, outxb, pgnd1 , pgnd2, rnf vref vlim, sense vcc 10k vcc 100k vcc vcc 200k vcc 1k pgnd1 pgnd2 rnf outxa vmx outxb 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [w] 0.880 w 0.458 w 85 c 0.0 0.2 0.4 0.6 0.8 1.0 0 25 50 75 100 125 150 ambient temperature : ta [c] power dissipation : pd [w] 0.875 w 0.455 w 85 c downloaded from: http:///
11 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 operational notes 1. reverse connection of power supply connecting the power supply in reverse polarity can damage the ic. take precautions against reverse polarity when connecting the power supply, such as mounting an extern al diode between the power supply and the ic s power supply pin s. 2. power supply lines design the pcb layout pattern to provide low impedance sup ply lines. separate the ground and supply lines of the digital and analog blocks to prevent noise in the grou nd and supply lines of the digital block from affecting the analog block. furthermore , connect a capacitor to ground at all power supply pins . consider the effect of temperature and aging on the capacitance value when using electrolytic capa citors. 3. ground voltage ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. ground wiring pattern when using both small-signal(gnd) and large-current groun d(pgnd) traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. also ensure that the ground traces of external components do not cause variations on the ground voltage. the ground line s must be as short and thick as possible to reduce lin e impedance. 5. thermal consideration should by any chance the power dissipation rating be exc eeded the rise in temperature of the chip may result in deterioration of the properties of the chip. in case of exceeding th is absolute maximum rating, increase the board size and copper area to prevent exceeding the pd rating. 6. recommended operating conditions these conditions represent a range within which the expe cted characteristics of the ic can be approximately obtained . the electrical characteristics are guaranteed under the condi tions of each parameter. 7. inrush current when power is first supplied to the ic, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the ic has more than one powe r supply. therefore, give special consideration to power co upling capacitance, power wiring, width of ground wiring, and routing of connections. 8. operation under strong electromagnetic field operating the ic in the presence of a strong electromagnetic field ma y cause the ic to malfunction. 9. testing on application boards when testing the ic on an application board, connecting a capacitor directly to a low-impedance output pin may subject the ic to stress. always discharg e capacitors completely after each process or step. the ic s power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. to prevent damage from static discharge, ground the ic during assembly and use similar precautions during transport and storage. 10. inter-pin short and mounting errors ensure that the direction and position are correct when mountin g the ic on the pcb. incorrect mounting may result in damaging the ic. avoid nearby pins being shorted to each other especially to ground, power supply and output pin . inter-pin shorts could be due to many reasons such as me tal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins du ring assembly to name a few. 11. unused input pins input pins of an ic are often connected to the gate of a mos trans istor. the gate has extremely high impedance and extremely low capacitance. if left unconnected, the elec tric field from the outside can easily charge it. the smal l charge acquired in this way is enough to produce a signi ficant effect on the conduction through the transistor and cause unexpected operation of the ic. so unless otherwise spe cified, unused input pins should be connected to the power supply or ground line. downloaded from: http:///
12 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 operational notes C continued 12. regarding the input pin of the ic this monolithic ic contains p+ isolation and p substrate la yers between adjacent elements in order to keep them isolated. p-n junctions are formed at the intersection of the p layers with the n layers of other elements, creating a parasitic diode or transistor. for example (refer to figure below): when gnd > pin a and gnd > pin b, the p-n junction operates as a paras itic diode. when gnd > pin b, the p-n junction operates as a parasitic transistor. parasitic diodes inevitably occur in the structure of the ic. the operation of parasitic diodes can result in mutual interference among circuits, operational faults, or physic al damage. therefore, conditions that cause these diodes t o operate, such as applying a voltage lower than the gnd vo ltage to an input pin (and thus to the p substrate) should be avoided. figure 7 . example of monolithic ic structure 13. ceramic capacitor when using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to dc bias a nd others. 14. area of safe operation (aso) operate the ic such that the output voltage, output current, and power dissipation are all within the area of safe operation (aso). 15. thermal shutdown circuit(tsd) this ic has a built-in thermal shutdown circuit that prevent s heat damage to the ic. normal operation should always be within the ics power dissipation rating. if however the rating is exceeded for a continued period, the junction temperature (tj) will rise which will activate the tsd circuit t hat will turn off all output pins. when the tj falls below the tsd threshold, the circuits are automatically restored to normal o peratio n. note that the tsd circuit operates in a situation that exceeds th e absolute maximum ratings and therefore, under no circumstances, should the tsd circuit be used in a set des ign or for any purpose other than protecting the ic from heat damage. n n p + p n n p + p substrate gnd n p + n n p + n p p substrate gnd gnd parasitic elements pin a pin a pin b pin b b c e parasitic elements gnd parasitic elements c be transistor (npn) resistor n region close-by parasitic elements downloaded from: http:///
13 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 ordering information b d 6 7 5 8 x x x - e 2 part number package mwv : uqfn036v5050 kn : vqfn36 packaging and forming specification e2: embossed tape and reel marking diagrams part number marki ng package orderable part number bd6758 uqfn036v5050 bd6758mwv- e2 bd6758 vqfn36 BD6758KN- e2 uqfn036v5050 (top view) b d 6 7 5 8 part number marking lot number 1pin mark vqfn36 (top view) b d 6 7 5 8 part number marking lot number 1pin mark downloaded from: http:///
14 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 physical dimension, tape and reel information package name uqfn036v5050 downloaded from: http:///
15 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 physical dimension, tape and reel information - continued package name vq fn36 downloaded from: http:///
16 / 16 tsz02201-0h3h0b601360-1-2 ? 20 15 rohm co., ltd. all rights reserved. www.rohm.com tsz22111 ? 15 ? 001 bd6758mwv BD6758KN 09.dec.2015 rev.001 revision history date revision changes 09.dec.2015 001 new release downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. notice precaution on using rohm products 1. our products are designed and manufac tured for application in ordinary elec tronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring ex tremely high reliability (such as medical equipment (note 1) , transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. (note1) medical equipment classification of the specific applications japan usa eu china class class class b class class ? class 2. rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4. the products are not subjec t to radiation-proof design. 5. please verify and confirm characteristics of the final or mounted products in using the products. 6. in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse. is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7. de-rate power dissipation depending on ambient temperature. when used in sealed area, c onfirm that it is the use in the range that does not exceed t he maximum junction temperature. 8. confirm that operation temperat ure is within the specified range described in the product specification. 9. rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document. precaution for mounting / circuit board design 1. when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2. in principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. if the flow sol dering method is preferred on a surface-mount products, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification downloaded from: http:///
datasheet d a t a s h e e t notice-pga-e rev.00 2 ? 2015 rohm co., ltd. all rights reserved. precautions regarding application examples and external circuits 1. if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2. you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1. product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2. even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3. store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since concerned goods might be fallen under listed items of export control prescribed by foreign exchange and foreign trade act, please consult with rohm in case of export. precaution regarding intellectual property rights 1. all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. rohm shall not have any obligations where the claims, actions or demands arising from the co mbination of the products with other articles such as components, circuits, systems or external equipment (including software). 3. no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the products or the informati on contained in this document. pr ovided, however, that rohm will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the produc ts, subject to the terms and conditions herein. other precaution 1. this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 2. the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 3. in no event shall you use in any wa y whatsoever the products and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 4. the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties. downloaded from: http:///
datasheet datasheet notice ? we rev.001 ? 201 5 rohm co., ltd. all rights reserved. general precaution 1. before you use our pro ducts, you are requested to care fully read this document and fully understand its contents. rohm shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny rohms products against warning, caution or note contained in this document. 2. all information contained in this docume nt is current as of the issuing date and subj ec t to change without any prior notice. before purchasing or using rohms products, please confirm the la test information with a rohm sale s representative. 3. the information contained in this doc ument is provi ded on an as is basis and rohm does not warrant that all information contained in this document is accurate an d/or error-free. rohm shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. downloaded from: http:///

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